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北京市自然科学基金(2982017)

作品数:3 被引量:34H指数:2
相关作者:张启运高苏劳邦盛廖复辉高苏更多>>
相关机构:北京大学更多>>
发文基金:北京市自然科学基金更多>>
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盐酸二乙胺与己二酸、癸二酸的相关系被引量:1
2000年
Phase diagrams and decomposition for systems of (C 2H 5) 2NH·HCl C 6H 10 O 4 (adipic acid) and (C 2H 5) 2NH·HCl C 10 H 18 O 4 (sebacic acid) have been investigated by DTA, DSC and visual polythermal methods. Both two systems are of the simple eutectic type. Eutectics are located in 50% of C 6H 10 O 4 at 94 ℃ and 55% of C 10 H 18 O 4 at 106 ℃ respectively. (C 2H 5) 2NH·HCl melts at 217 ℃ and decomposes as soon as it just melted. A polymorphic reaction of (C 2H 5) 2NH·HCl occurs at 98 ℃, the transition heat is 29.7 J/g. Experiments also revealed that adipic acid melts at 152.8—155.7 ℃ with melting heat 199.1 J/g, decomposes at 250.8—263.0 ℃ with decomposition heat 174.2 J/g; sebacic acid melts at 133.1—135.9 ℃ with melting heat 199.8 J/g and decomposes at 233.2—269.2 ℃, but no exact value of decomposition heat has been determined. [WT5HZ]
廖复辉高苏张启运
关键词:己二酸癸二酸相图
电子元件覆锡铜引线的腐蚀机制被引量:6
2002年
电子元件覆锡铜引线的可焊性常因储存时间的延长而大大恶化.本文通过金相、XPS、电池断路电位和润湿性测定等方法判断可焊性恶化的机制是:铜—锡金属间化合物η相(Cu6Sn5)微晶向锡表面扩散,与锡形成微电池对,遇到空气中的水份与酸气氛构成电化腐蚀所致.
高苏张启运
关键词:可焊性热浸锡电镀锡电化学腐蚀
固-液金属界面上金属间化合物的非平衡生长被引量:29
2001年
The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1~ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.
劳邦盛高苏张启运
关键词:金属间化合物钎焊
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