5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analysis（PCA） is used in the analysis of the sample data firstly. And then the process is controlled with hotelling T^2 control chart for the first several principal components which contain sufficient information. Furthermore, a software tool is developed for this kind of problems. And with sample data from a surface mounting device（SMD） process, it is demonstrated that the T^2 control chart with PCA gets the same conclusion as without PCA, but the problem is transformed from high-dimensional one to a lower dimensional one, i.e., from 5 to 2 in this demonstration.
The relationship between major quality tools such as quality function development （QFD）, failure mode and effects analysis （FMEA）, design of experiments （DOE） and statistical process control （SPC） is analyzed through an extensive review of the literature and the concurrent quality engineering philosophy, and a basic structure for the integration of quality tools is presented. An integrated quality management system （IQMS） is developed using C＋＋ Builder, running in the Windows 2000 Server environment with the basic internet connections, and SQL Server 2000 as the platform for developing the database, An illustrative example applying IQMS to the continuous quality improvement for a crane equipment manufacturing is reported. The result shows that the application of IQMS can optimize the process of design and manufacturing, shorten the cycle time of product, reduce the cost, and realize quality improvement continuously, The proposed integrated framework with IOMS is believed to be applicable to continuous quality improvement in many manufacturing companies.
