A 30Gbit/s receptor module is developed with a CMOS integrated receiver chip（IC） and a GaAs-based 1 × 12 photo detector array of PIN-type. Parallel technology is adopted in this module to realize a high-speed receiver module with medium speed devices. A high-speed printed circuit board（PCB） is designed and produced. The IC chip and the PD array are packaged on the PCB by chip-on-board technology. Flip chip alignment is used for the PD array accurately assembled on the module so that a plug-type optical port is built. Test results show that the module can receive parallel signals at 30Gbit/s. The sensitivity of the module is - 13.6dBm for 10^-13 BER.
