This paper investigates shear horizontal （SH） waves propagating in a periodically layered structure that consists of piezoelectric （PE） layers perfectly bonded with piezomagnetic （PM） layers alternately. The explicit dispersion relations are derived for the two cases when the propagation directions of SH waves are normal to the interface and parallel to the interface, respectively. The asymptotic expressions for dispersion relations are also given when the wave number is extremely small. Numerical results for stop band effect and phase velocity are presented for a periodic system of alternating BaTiO3 and Terfenol-D layers. The influence of volume fraction on stop band effect and dispersion behaviors is discussed and revealed.
To simulate the nonlinear behavior of ferroelectric structures and devices under non-uniform electromechanical loadings,a domain-switching embedded electromechanical finite element method is developed in this paper.Following continuum assumption,the electromechanical behavior of each representative material point can be obtained by averaging the behavior of the local corresponding microstructure,e.g.42 domains used in this work.A new Double Gibbs free energy criterion for domain-switching is proposed to ensure the convergence and stability of the simulations on ferroelectrics under non-uniform field.Several computational examples are given to demonstrate that this nonlinear finite element method can yield reasonable and stable simulation results which can be used to explain some experimental results and assist the design of ferroelectric devices.
Stretchable electronics represents a direction of recent development in next-generation semiconductor devices.Such systems have the potential to offer the performance of conventional wafer-based technologies,but they can be stretched like a rubber band,twisted like a rope, bent over a pencil,and folded like a piece of paper.Isolating the active devices from strains associated with such deformations is an important aspect of design.One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple,analytical model and validates the results by the finite element method.The results show that a relatively thick,compliant adhesive is effective to reduce the strain in the electronics,as is a relatively short film.
