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国家自然科学基金(10874065)

作品数:5 被引量:10H指数:2
相关作者:刘治国朱健民宋晔朱信华杭启明更多>>
相关机构:南京大学更多>>
发文基金:国家自然科学基金国家重点基础研究发展计划江苏省自然科学基金更多>>
相关领域:一般工业技术电气工程自动化与计算机技术电子电信更多>>

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Challenges in Atomic-Scale Characterization of High-k Dielectrics and Metal Gate Electrodes for Advanced CMOS Gate Stacks被引量:1
2009年
The decreasing feature sizes in complementary metal-oxide semiconductor (CMOS) transistor technology will require the replacement of SiO2 with gate dielectrics that have a high dielectric constant (high-k) because as the SiO2 gate thickness is reduced below 1.4 nm, electron tunnelling effects and high leakage currents occur in SiO2, which present serious obstacles to future device reliability. In recent years significant progress has been made on the screening and selection of high-k gate dielectrics, understanding their physical properties, and their integration into CMOS technology. Now the family of hafnium oxide-based materials has emerged as the leading candidate for high-k gate dielectrics due to their excellent physical properties. It is also realized that the high-k oxides must be implemented in conjunction with metal gate electrodes to get sufficient potential for CMOS continue scaling. In the advanced nanoscale Si-based CMOS devices, the composition and thickness of interfacial layers in the gate stacks determine the critical performance of devices. Therefore, detailed atomic- scale understandings of the microstructures and interfacial structures built in the advanced CMOS gate stacks, are highly required. In this paper, several high-resolution electron, ion, and photon-based techniques currently used to characterize the high-k gate dielectrics and interfaces at atomic-scale, are reviewed. Particularly, we critically review the research progress on the characterization of interface behavior and structural evolution in the high-k gate dielectrics by high-resolution transmission electron microscopy (HRTEM) and the related techniques based on scanning transmission electron microscopy (STEM), including high-angle annular dark- field (HAADF) imaging (also known as Z-contrast imaging), electron energy-loss spectroscopy (EELS), and energy dispersive X-ray spectroscopy (EDS), due to that HRTEM and STEM have become essential metrology tools for characterizing the dielectric gate s
Xinhua Zhu Jian-min Zhu Aidong Li Zhiguo Liu Naiben Ming
关键词:HRTEMSTEM
外延BiFeO_3多铁性纳米岛的化学自组织法制备及其表征被引量:2
2010年
采用化学自组织方法在SrTiO_3(100)及Nb-掺杂SrTiO_3(100)单晶衬底上制备了外延BiFeO_3纳米岛,并利用X射线衍射、扫描电子显微镜和原子力显微镜对纳米岛的相结构及形貌进行了表征.结果表明,在650~800℃下后退火1h可获得外延的BiFeO_3纳米岛,岛横向尺寸在50~150 nm之间,纵向尺寸在6~12 nm之间.随着纳米岛后退火温度的升高,其(100)面内的几何形貌由三角形状转向四边形状,然后再趋向于长棒状.利用压电力显微镜,对单个BiFeO_3纳米岛(横向尺寸~50 nm,高度12 nm)的铁电特性进行表征.结果表明,单个外延BiFeO_3纳米岛内存在分形铁电畴和自偏压极化现象,其中自偏压极化现象来源于外延BiFeO_3纳米岛与SrTiO_3单晶衬底之间的界面应力.
朱信华杭启明邢智彪汤振杰宋晔朱健民刘治国
关键词:BIFEO3
Synthesis, Microstructure, and Dielectric Properties of Mn-doped 0.33BaTiO_3-0.67BiFeO_3 Multiferroic Solid Solutions
In this work, 0.33BaTiO3-0.67BiFeO3 multiferroic ceramics doped with x mol% MnO2 (x= 0.1-1.0) were fabricated ...
Qiming HangFeng ShanJianmin ZhuXinhua Zhu
关键词:BATIO3BIFEO3
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纳米结构铁电膜的制备和物性及微结构表征
2010年
采用脉冲激光淀积法在硅基氧化铝纳米有序孔膜版介质上(膜版孔径平均尺寸25nm,内生长Pt纳米线作为底电极一部分)制备了纳米结构的BaTiO3铁电膜(膜厚25nm),并对其铁电和介电性能以及微结构进行了表征.结果表明,BaTiO3铁电纳米膜的介电常数随着测量频率的增加(103~106Hz)从196缓慢下降到190;介电损耗在低频区域(103~105Hz)从0.005缓慢增加到0.007,而在高频率区域(>105Hz)快速增加到0.013.薄膜的剩余极化强度约为5μC/cm2,矫顽场强约为680kV/cm.剖面(S)TEM像表明,BaTiO3铁电纳米膜与Pt纳米线(底电极)直接相连,它们之间的界面具有一定程度的弯曲.为兼顾氧化铝纳米有序孔膜版内的金属纳米线有序分布及BaTiO3纳米膜的结晶度,选择合适的退火温度是制备工艺中的关键因素.
朱信华宋晔杭启明朱健民周顺华刘治国
关键词:BATIO3微结构
水热反应条件对BaTiO3纳米晶形成的影响及其原子尺度表面结构被引量:2
2009年
本文报道了水热反应条件对BaTiO3纳米晶形成的影响,尤其是其原子尺度的表面结构。研究结果表明,Ba/Ti摩尔比较大的前驱体溶液中,易获得立方状大尺寸(~260nm)的BaTiO3纳米晶体;而采用乙二醇作为水热反应介质,可获得小尺寸弱圉聚的BaTiO3纳米晶(与纯水溶液或水-乙二醇的混合液相比较)。立方状或长方体状的BaTiO3纳米晶外表面被{100}晶面所包围,{110}晶面条纹与纳米晶体的边界相交呈45°角。在粗糙的BaTiO3纳米晶表面,常可观察到台面台阶扭折(terrace—ledge—kink)的表面结构,台面(terrace)和台阶(1edge)位于{100}晶面。由于表面结构的重构,{110}晶面通常被分解成由许多小的{100}晶面相连接而成的扭折结构。而在球状的BaTiO3纳米晶边缘,没有观察到表面台阶结构。
朱信华朱健民宋晔周舜华刘治国
Effect of Solvent on the Self-ordering of Porous Anodic Alumina
Porous anodic alumina (PAA) films are usually fabricated in aqueous solutions.In this work,ethylene glycol (EG...
Ye Song
关键词:NANOSTRUCTURES
纳米结构PZT铁电膜的制备及其表征被引量:5
2010年
采用溶胶-凝胶(sol-gel)自旋涂敷法在硅基氧化铝纳米有序孔膜版介质上(膜版孔径尺寸20~100nm,内生长金属纳米线作为底电极一部分)制备Pb(Zr0.53Ti0.47)O3(PZT)纳米结构铁电膜,并对其介电、铁电性能及微结构进行了表征。介电测量结果表明,厚度25nm的PZT铁电膜,其介电常数在低频区域(频率<104Hz)从860迅速下降到100,然后保持在100左右,直至测量频率升高到106Hz。低频区域的介电常数迅速下降是由空间电荷极化所致,它与薄膜和电极之间聚集的界面空间电荷密切相关,尤其是在薄膜与Au纳米线的弯曲界面处。介电损耗在4000Hz附近出现峰值,它来源于空间电荷的共振吸收效应。电滞回线测量结果表明,厚度为100nm的PZT铁电膜,其剩余极化强度为50μC/cm2,矫顽场强为500kV/cm。剖面透射电镜(TEM)像表明PZT纳米铁电膜与底电极(金属纳米线)直接相接触,它们之间的界面呈现一定程度的弯曲。在PZT纳米铁电薄膜后退火处理后,发现部分Au金属纳米线顶端出现分枝展宽现象;而改用Pt纳米线后可有效抑制这种现象。为兼顾氧化铝纳米有序孔膜版内的金属纳米线有序分布及PZT纳米膜的结晶度,选择合适的退火温度是制备工艺中的关键因素。
朱信华宋晔杭启明朱健民周舜华刘治国
关键词:PZT
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