The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper.The aluminum-aluminum adherends are bonded by two different adhesives:polydimethylsiloxane (PDMS) and epoxy.The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope.Then,the shear modulus values of the two adhesives are calculated with a simple pure shear strain model.A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results.The results show that this method can successfully estimate the shear modulus of the adhesive layer.The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.
The fabrication technique of micro/nano-scale speckle patterns with focused ion beam (FIB) system is studied for digital image correlation (DIC) measurement under a scanning electron microscope (SEM).The speckle patterns are fabricated by directly etching the counterpart of the specimen to the black part of a template.Mean intensity gradient is used to evaluate the quality of these SEM images of speckle patterns fabricated based on different templates to select an optimum template.The pattern size depending on the displacement measurement sensitivity is adjusted by altering the magnification of FIB according to the relation curve of the etching size versus magnification.The influencing factors including etching time and ion beam current are discussed.Rigid body translation tests and rotation tests are carried out under SEM to verify the reliability of the fabricated speckle patterns.The calculated values are in good agreement with the imposed ones.
LI YanJieXIE HuiMinLUO QiangGU ChangZhiHU ZhenXingCHEN PengWanZHANG QingMing
In this study,we theoretically investigate the dynamic indentation for measuring the loss (damping) factor of a linear viscoelastic material from its indentation response.A rigid indenter with arbitrary tip profile is assumed to indent into a viscoelastic substrate with arbitrary shape.We perform a theoretical analysis and identify the conditions under which the loss factor of the material can be determined from the phase angle between the applied harmonic indentation load and the corresponding harmonic displacement,a directly measurable quantity in a dynamic indentation test.To validate the conclusion drawn from our theoretical analysis,a series of numerical experiments are performed,including the spherical indentation of a soft layer with irregular surface morphology bonded to a rigid substrate,a conical indenter with tip defects indenting into a half-spherical particle,and the indentation of porous materials.This study may facilitate the use of the dynamic indentation technique to evaluate the damping properties of linear viscoelastic materials,including some advanced polymers and biological soft tissues.
Wrinkling and buckling of nano-films on the compliant substrate are always induced due to thermal deformation mismatch.This paper proposes effective means to control the surface wrinkling of thin film on the compliant substrate,which exploits the curvatures of the curve cracks designed on the stiff film.The procedures of the method are summarized as:1)curve patterns are fabricated on the surface of PDMS(Polydimethylsiloxane)substrate and then the aluminum film with the thickness of several hundred nano-meters is deposited on the substrate;2)the curve patterns are transferred onto the aluminum film and lead to cracking of the film along the curves.The cracking redistributes the stress in the compressed film on the substrate;3)on the concave side of the curve,the wrinkling of the film surface is suppressed to be identified as shielding effect and on the convex side the wrinkling of the film surface is induced to be identified as inductive effect.The shielding and inductive effects make the dis-ordered wrinkling and buckling controllable.This phenomenon provides a potential application in the fabrication of flexible electronic devices.
This paper investigates the effect of the location of testing area in residual stress measurement by Moiréinterferometry combined with hole-drilling method.The selection of the location of the testing area is analyzed from theory and experiment.In the theoretical study,the factors which affect the surface released radial strainεr were analyzed on the basis of the formulae of the hole-drilling method,and the relations between those factors andεr were established.By combining Moiréinterferometry with the hole-drilling method,the residual stress of interference-fit specimen was measured to verify the theoretical analysis.According to the analysis results,the testing area for minimizing the error of strain measurement is determined.Moreover,if the orientation of the maximum principal stress is known,the value of strain will be measured with higher precision by the Moiréinterferometry method.
In this paper,a new method combining focused ion beam(FIB)and scanning electron microscope(SEM)Moirétechnique for the measurement of residual stress at micro scale is proposed.The FIB is employed to introduce stress relief like the macro ring-core method and fabricate gratings with a frequency of 5000 lines/mm on the measured area of the sample surface.Three groups of gratings in different radial directions are manufactured in order to form a micro-scale strain rosette.After milling ring-core by FIB,the deformation incurred by relief of the stress will be recorded with the strain rosette.The displacement/strain field can be measured using SEM scanning Moiréwith random phase-shifting algorithm.In this study,the Nickel alloy GH4169 sample(which was processed by laser shock peening)is selected as a study object to determine its residual stress.The results showed that the components of the in-plane principal stresses were-359 MPa and-207 MPa,respectively,which show good agreement with the results obtained from the available literature.
