Copper corrosion in citric acid based slurries with or without benzotriazole (BTA) was investigated as a function of the slurry pH,immersion time and BTA concentration by static etching and electrochemical experiments.The chemical composition of the corroded surface was determined using X-ray photoelectron spectroscopy (XPS).The static etching rate of copper in a H2O2 +citric acid+BTA slurry was lower than that in a H2O2 +citric acid slurry at pH 4.4-8.When the pH of the slurry was >8 or <4.4,the results were reversed and the static etching rate of copper increased when BTA was added to the H2O2 +citric acid slurry.The inhibitory effect of BTA in the H2O2 +citric acid slurry at pH 6 increased with the increasing immersion time of the copper.The corrosion current density of copper gradually decreased with increasing BTA concentration in slurry.
